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Many EMI problems can be solved with a thin conductive layer, application of glue or a coating. This only applies where slight reduction is required.
For EMI/RFI shielding of plastic housings and plastic components
Electrically conductive glue / Electrically conductive adhesive for EMI / RFI shielding and ESD applications
Thermal grease and thermal pads are thermally conductive adhesive, which are commonly used as an interface between heat sinks and heat sources (e.g., high-power semiconductor devices). The grease and the pads give a mechanical strength to the bond between the heat sink and heat source. More importantly, it eliminates air (which is a thermal insulator) from the interface area.